창성주식회사

PRODUCT

Texturing

PSG

※Solar 공정

Texturing

1. SDR

KOH, HF 등의 Chemical을 이용하여 Texturing을 진행 후 DI.W Rinse세정, 건조하여 취출하는 장비

Wet Cleaner is removing about particle on the bath & textures the wafer surface

  • Size dimension may vary per customer's option
  • Automatic Transfer by WTR
  • Non Contact Transfer : CST Transfer system
  • Full automated by PLC & CIM PC
  • Hot Diw & Chemical (option)
  • System : Sonic, Bubble Jet, Spray, Dry (option)

2. Texturing 구조 및 형상

1. PSG

HF, DI.W등을 이용하여 산화막을 제거 후 Rinse 세정, 건조 하여 취출하는 장비

Wet Cleaner is remove the oxide film and particles on the surface of the wafer in the bath

  • Size dimension may vary per customer's option
  • Automatic Transfer by WTR
  • Non Contact Transfer : CST Transfer system
  • Full automated by PLC & CIM PC
  • Hot Diw & Chemical (option)
  • System : Sonic, Bubble Jet, Spray, Dry (option)

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